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Clearfield intros new combo cabinet

Wed, 05/30/2012 - 3:00pm
Brian Santo

Clearfield's FieldSmart Hub Collapse Cabinet (HCC)Clearfield has introduced a new cabinet designed to let cable operators separate their passive infrastructure from the electronics without the need for a standard hub architecture.

The company’s FieldSmart Hub Collapse Cabinet (HCC) can house both optical components and fiber terminations. It can accommodate up to 120 fiber terminations using Clearfield’s Clearview Cassette. The HCC also allows for up to 32 LGX-compatible CWDM/DWDM modules to utilize existing optical components in the network. Fiber management and designation has been designed into the HCC for ease of use and accessibility.

Without the FieldSmart HCC, moves, adds and changes (MAC) required at the physical layer need to be done with a boom truck. As a result, in some locations, the cost of the MAC skyrocketed, the company explained. The FieldSmart HCC is easily pole-mounted near the O-Hub so that all MAC work is done on the ground, dramatically lowering its cost. In addition, the electronics remain deployed near the neighborhood where the bandwidth is required, but is no longer at risk due to craft person access, the company said.

The HCC comes in 16-inch by 16-inch by 32-inch housing. The cabinet offers multiple mounting options (pole, pad or vault mount).

“New technologies are being brought to market to collapse the hub architecture, move fiber close to the consumer and effectively increase speeds,” said Johnny Hill, chief operating officer of Clearfield. “Field engineers within the cable television markets deploying these new electronics have been thrilled with the cost-effective means to extend their existing infrastructure but have been challenged by the inconvenience of housing the electronics and passive connectivity within the same enclosure. With our new FieldSmart HCC, our customers have reported that they have been able to collapse the hub and move the electronics and fiber closer to the user with the added convenience of separating the electronics, optical components and fiber connectivity.”

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