STMicroelectronics chip gets DOCSIS 3.0 certification
STMicroelectronics said it has reached DOCSIS 3.0 certification for its system-on-chip (SoC) products addressing the cable-data gateway and interactive set-top box markets.
The first of STMicroelectronics’ DOCSIS 3.0 silicon products supports the bonding of up to 16 downstream and 4 upstream channels, enabling data speeds of up to 800 Mbps downstream and 108 Mbps upstream. Another supports the bonding of 12 channels.
The core of the DOCSIS 3.0 chips is a 4000 Dhrystone MIPS processor, which together with hardware accelerators execute gateway functions including line-rate data switching / routing, PacketCabletelephony, LAN / WLAN networking management and home automation, the company said.
The DOCSIS chip can be paired with STMicroelectronics’ full-band tuner front-end, gateway SoC, and software. The company is making available an optimized reference design, which it says combines high performance and low power consumption, and is ready for immediate market deployment.
ST’s DOCSIS 3.0 devices include the STiD128 for 16x4 data gateway, the STiD127 for 16-channel interactive set-top box, and the STiD125 for 12-channel applications, and all these are available to customers for sampling and volume production.