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Ramping up interconnect speeds

Wed, 10/11/2000 - 8:00pm
Staff

Motorola, Tundra form alliance for next generation interconnect products

Tundra Semiconductor and Motorola Semiconductor Products Sector are partnering to develop high performance interconnect products that increase the efficiency and capacity of Motorola's Smart Networks Platform.

The partnership will tap into the communications semiconductor market, which is expected to exceed $50 billion in revenue by 2003, according to the market research firm Dataquest.

Tundra and Motorola will help design the PowerPC and RapidIO-related core logic technology that can be incorporated into the Tundra System Interconnect products and Motorola's communications processors. These include PowerPC host processors, PowerQUICC integrated processors, and C-Port network processors.

As part of the multi-year, multi-million dollar agreement, Motorola will provide Tundra with funding to develop these new RapidIO core logic products.

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